3 edition of Fracture toughness of polyimide films found in the catalog.
Fracture toughness of polyimide films
by National Aeronautics and Space Administration, National Technical Information Service, distributor in [Washington, D.C.?, Springfield, Va
Written in English
|Statement||J.A. Hinkley and S.L. Mings.|
|Series||NASA-TM -- 103473., NASA technical memorandum -- 103473.|
|Contributions||Mings, S. L., United States. National Aeronautics and Space Administration.|
|The Physical Object|
|Pagination||6,  leaves|
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It is reported that the material toughness for thin films is strongly dependent on the thickness. In particular, it has been shown that whilst in thick films typical values are between 25 MPa m 1. Get this from a library. Fracture toughness of polyimide films.
[Jeffrey A Hinkley; S L Mings; United States. National Aeronautics and Space Administration.]. Optimizing ductility and fracture of amorphous metal thin films on polyimide using multilayers. the interface toughness of the film/substrate can be increased by almost twenty times. The.
The tensile measurements of the films showed that, with the increase of the polyimide content, tensile modulus of the film increased but there was almost no change in the elongation at break.
T. Agag and T. Takeichi, “Synthesis and characterization of epoxy film cured with reactive polyimide,” Polymer, 40, No. 23, – (). Article CASCited by: 8. Purchase Fracture of Polymers, Composites and Adhesives, Volume 27 - 1st Edition.
Print Book & E-Book. ISBNBook Edition: 1. Jeffrey A. Hinkley currently works at the Langley Research Center, NASA. Jeffrey does research in Polymer Chemistry, Chemical Engineering and .